• 国税地税合并!国家税务总局河北省税务局正式挂牌 2019-03-19
  • 记者带你逛CES:体验未来科技 2019-01-30
  • 北京市党政代表团赴疆考察对接援疆扶贫工作 2019-01-30
  • 清凉端午过后 气温重回30℃ 2018-12-17
  • C罗一战创造5大不可思议纪录!这一刻请高呼他为球王 2018-12-17
  • 【新媒体矩阵】长城评论微信公众号 2018-12-08
  • 本论坛上有位网名为“第十阶层1”的网友,你可问问他“阶层”与“阶级”有什么区别!呵呵! 2018-12-08
  • 交通部发布端午假期出行指南 教你如何避堵 2018-12-01
  • 3岁小孩骑童车绊倒老人算交通事故警察这样解释 2018-12-01
  • Be guided by purpose

    Technical Path

    • 2002  Established the first domestic SMD LED packaging lines

    • 2005  Approved high power ceramic led patent, package technology and package product

    • 2006  DA-epoxy ohmic contact bottom line protection technology and patent

    • 2009  TOP LED. Technology improvement of die bounding, Refond was the first to promote the 30mA driven TOP LED

    • 2010  LED TV backlight overall solution and products; High power package phosphor coating technology improvement and lens molding technology

    • 2011  Promoted TOP LED 4014, 7020

    • 2012  High power LED phosphor KL graphical coating; Promoted PCT TOP LED

    • 2013  High power LED eutectic bonding technology MP application

    • 2013  360°emitting package and filament product

    • 2014  CSP patent, technology and product solution; Inorganic package technology and product solution, EMC LED MP

    • 2015  Refond laboratory got CNAS certification

    • 2016  Flip chip on board 3D package technology awarded the first and second prize in national technical inventions.

    • 2017  Micro lens production technology and package application solution


    REFOND-gongs技术历程.jpg

  • 国税地税合并!国家税务总局河北省税务局正式挂牌 2019-03-19
  • 记者带你逛CES:体验未来科技 2019-01-30
  • 北京市党政代表团赴疆考察对接援疆扶贫工作 2019-01-30
  • 清凉端午过后 气温重回30℃ 2018-12-17
  • C罗一战创造5大不可思议纪录!这一刻请高呼他为球王 2018-12-17
  • 【新媒体矩阵】长城评论微信公众号 2018-12-08
  • 本论坛上有位网名为“第十阶层1”的网友,你可问问他“阶层”与“阶级”有什么区别!呵呵! 2018-12-08
  • 交通部发布端午假期出行指南 教你如何避堵 2018-12-01
  • 3岁小孩骑童车绊倒老人算交通事故警察这样解释 2018-12-01